Pressco are well established in providing high quality precision components, assemblies and fabrication to Semiconductor and Original Equipment Manufacturers.
We provide meaningful alternative sourcing by seeking to help our customers Improve: Yield / Production Time / Lead Time / Quality / Cost.
This within a culture of providing the highest level of :-
• Confidentiality • Back up Data & Traceability • Copy exact • Demonstrating Clear advantage for change
We have gained considerable experience in providing solutions and parts for Wafer Processing, Handling, Assembly, Packaging & Back End Test, whilst also providing a wealth of applications in Hard Drive Disc Manufacturing:-
• Substrate Machining & Grinding • Nickel Alloy Plating of the Substrate • Nickel Polishing & Cleaning • Sputtering & Lubrication • Head Stack Assembly • Final Assembly Labeling & Packaging
In servicing our Semconductor customers needs, we can utilize our dedicated White Room facility for machining Plastics, our Esd controlled assembly area with laminar flow modules, and our electronic & mechanical design engineers.
These resources combined with our experience in machining metals and high performance plastics such as Torlon, Vespel, PEEK, Techtron & Semitron ESd Materials make Pressco your ideal partner for Semiconductor components and assemblies.
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Pressco Ltd. - an I.S. EN ISO 13485:2003 & I.S. EN ISO 9001:2008 registered company.